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thermal pads die-cut

thermal pads die-cut

Many of our customers are using thermal pads nowadays. With another year in the books, the electronics used this year are at an all-time high. This requires more cooling! To finish off the year, we thought we would make a blog about a few tips on choosing a thermal pad. As always, this list does not include all the considerations when picking a pad – that is up to the designer/user. 

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A. Softness(Hardness)

B. Modulus(usually Young’s Modulus)

C. Thermal Impedance- usually presented vs. strain(as °C-in.2 /W)

D. Thermal Conductivity – usually as W/m-K

These qualities help paint a better illustration of how the pad will perform in the application in consideration with the pressure exhibited in an application.

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These things may include a few things:

-Little Outgassing

-No Silicone 

-Electrical Isolation

Sometimes outgassing, or no silicone is an afterthought, it is wise to think of this beforehand. Many thermal pads manufacturers offer low outgassing, or silicone-free options. In addition, electrical isolation is almost universally available as most pads utilize silicone binders.

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These include questions similar to the above, but different. Well, if the application is under no pressure, or little – maybe no reinforcement at all is required. However, there are special pads made with high levels of reinforcement designed for applications that may see a lot of situations that would require it to be durable.

Reinforcements can include:

-Aluminum

-Polyimide

-Fiberglass

-Sil-Pads from Bergquist such as SP900S

As an additional note, most thermal gap filler pads have an attachment method such as naturally occurring tack, or a pressure-sensitive adhesive. 

For more information on thermally conductive pads, or you have questions about thermal pads please contact sales@nedc.com

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